ABSTRACT:
DC–DC
converters with voltage boost capability are widely used in a large number of
power conversion applications, from fraction-of-volt to tens of thousands of
volts at power levels from milliwatts to megawatts. The literature has reported
on various voltage-boosting techniques, in which fundamental energy storing
elements (inductors and capacitors) and/or transformers in conjunction with
switch(es) and diode(s) are utilized in the circuit. These techniques include
switched capacitor (charge pump), voltage multiplier, switched inductor/voltage
lift, magnetic coupling, and multistage/-level, and each has its own merits and
demerits depending on application, in terms of cost, complexity, power density,
reliability, and efficiency. To meet the growing demand for such applications,
new power converter topologies that use the above voltage-boosting techniques,
as well as some active and passive components, are continuously being proposed.
The permutations and combinations of the various voltage-boosting techniques with
additional components in a circuit allow for numerous new topologies and
configurations, which are often confusing and difficult to follow. Therefore,
to present a clear picture on the general law and framework of the development
of next-generation step-up dc–dc converters, this paper aims to comprehensively
review and classify various step-up dc–dc converters based on their
characteristics and voltage-boosting techniques. In addition, the advantages
and disadvantages of these voltage-boosting techniques and associated
converters are discussed in detail. Finally, broad applications of dc–dc
converters are presented and summarized with comparative study of different
voltage-boosting techniques.
KEYWORDS:
1. Coupled inductors
2. Multilevel converter
3. Multistage converter
4. Pulse width modulated (PWM) boost converter
5. Switched capacitor (SC)
6. Switched inductor
7. Switched mode step-up dc–dc converter
8. Transformer
9. Voltage lift (VL)
10. Voltage multiplier
SOFTWARE: MATLAB/SIMULINK
CONCLUSION:
The ongoing technological progress in
high-voltage step-up dc–dc converter has five primary drivers—energy
efficiency, power density, cost, complexity, and reliability—all of which also
influence each other to some extent. Table X, along with the spider wave
diagram in Fig. 34, provides a comparative summary of various voltage-boosting
techniques in terms of their major characteristics (i.e., power level, cost,
reliability, efficiency, power density, weight, integration, and complexity).This
view facilitates quick selection between related alternatives for special load
and application requirements. Each voltage boosting technique has its own
unique features and suitable applications, and there is no one-size-fits-all
solution. Nevertheless, it is generally not fair to permanently favor any
particular technique or solution. The converter topology and control method,
which was seen as complex and inefficient a decade back, has now become a key
solution for many industries and applications. In this manner, new topologies
based on different and often merged voltage-boosting techniques will continue
to appear in order to meet and improve the performance of different applications.
Thanks to the progress in power-semiconductor devices, new widebandgap devices
(GaN, SiC, etc.), advanced magnetic materials, high-performance digital control
platforms, and advanced design and packaging including thermal management (3-D
integrated) have all become a reality. These advances will undeniably
enablemore powerful and advanced power converter solutions for the next
generation of power conversion systems. Overall, the authors hope that this
comprehensive survey will be a useful resource to help both academic and
industry readers comprehend step-up dc–dc converter topologies and identify
their respective pros and cons.
REFERENCES:
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[2] B. K. Bose, “The past, present, and
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